Jumper Chip "RPC Series"
Introducing jumper chips compatible with automatic implementation machines using taping methods!
The "RPC Series" is a jumper (0Ω) chip compatible with flow and reflow soldering, as well as automatic placement machines using taping methods. It features a robust three-layer electrode structure that prevents solder wicking. Additionally, it does not use mercury, cadmium, hexavalent chromium, polybrominated biphenyls, or polybrominated diphenyl ethers. 【Features】 ■ Jumper (0Ω) chip ■ Robust three-layer electrode structure that prevents solder wicking ■ Compatible with flow and reflow soldering ■ Compatible with automatic placement machines using taping methods ■ AEC-Q200 compliant (data acquisition) Note: Some may not be compliant. *For more details, please refer to the PDF document or feel free to contact us.
- Company：太陽社電気
- Price：Other
